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Upcoming Scopus and IEEE Conferences in January & February 2027: A Complete Guide for Researchers

Your Go-To Directory for High-Impact Publications, Conference Call for Papers, and Scholarly Excellence

Dr Pankaj Mishra November 4, 2026 13 min read
Upcoming Scopus and IEEE Conferences in January & February 2027: A Com

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Your Go-To Directory for High-Impact Publications, Conference Call for Papers, and Scholarly Excellence


Upcoming Scopus & IEEE Conferences in Various Subjects (January & February 2027): Dates, Submission Deadlines, Publication Opportunities, and Registration Fees


1. Introduction: Navigating the 2027 Conference Horizon

As the academic year progresses into 2027, researchers, doctoral candidates, master’s scholars, and faculty members worldwide are actively mapping out their publication strategies. Presenting scholarly work at prestigious international conferences is not merely a institutional requirement; it serves as a vital platform for knowledge exchange, networking, collaborative research, and establishing career credentials.

Among the most sought-after academic venues, conferences indexed in Scopus and technical co-sponsored events by the Institute of Electrical and Electronics Engineers (IEEE) stand as benchmarks of academic rigor and visibility. As we look ahead to January and February 2027, numerous high-level international conferences across diverse disciplines—ranging from Artificial Intelligence, VLSI Design, and Cloud Computing to Renewable Energy, Biomedical Engineering, Social Sciences, and Sustainable Management—are opening their portals for abstract and full-paper submissions.

However, tracking down accurate submission deadlines, understanding registration fee structures, identifying indexing assurances (such as IEEE Xplore digital library archiving and Scopus submission), and preparing a manuscript that passes strict single-blind or double-blind peer review can be overwhelming. This comprehensive guide provides a detailed breakdown of top IEEE and Scopus-indexed conferences scheduled for January and February 2027, outlining critical dates, technical tracks, registration costs, publication pathways, and practical submission strategies.

2. The Strategic Importance of Scopus & IEEE Conference Publications

Understanding the distinction and value proposition of indexing agencies helps scholars align their manuscript target with their career objectives:

A. IEEE Xplore Digital Library

IEEE conferences represent the pinnacle of technical excellence in Electrical Engineering, Computer Science, Electronics, Robotics, Telecommunications, and Information Technology. Accepted papers presented at IEEE conferences are typically submitted for inclusion into the IEEE Xplore Digital Library. Once indexed in IEEE Xplore, these papers automatically undergo indexing by major abstracting and indexing (A&I) databases, prominently including Scopus, Web of Science (WoS), and Google Scholar.

B. Scopus Indexing Standard

Scopus, managed by Elsevier, is one of the world's largest peer-reviewed abstract and citation databases. Academic evaluation committees, university grant panels, national ranking systems (such as NIRF, NAAC, QS World Rankings), and doctoral defense boards prioritize Scopus-indexed proceedings and journals. Publishing in a genuine Scopus-indexed conference proceedings (such as IEEE Proceedings, Springer LNCS/LNEE, AIP Conference Proceedings, or Elsevier Procedia) ensures that your research gains international citation exposure, H-index contribution, and institutional compliance.

Crucial Academic Advice: Always verify that a conference organizer provides a specific publisher name (e.g., IEEE, Springer, ACM, IOP Publishing) and a verified ISBN/ISSN series. Beware of standalone claims of "Scopus indexing" without a named published proceeding.

3. Key Scopus & IEEE Conferences in January 2027

January marks the beginning of the international academic calendar, featuring prominent flagship symposiums, particularly in the Indian subcontinent, Southeast Asia, and North America.

3.1 40th International Conference on VLSI Design & 26th International Conference on Embedded Systems (VLSID 2027)

Organizing Body / Technical Co-Sponsor: IEEE Circuits and Systems Society (CASS) / IEEE Computer Society

Conference Dates: January 2 – January 6, 2027

Location: Bengaluru, Karnataka, India (Hybrid Mode)

Major Subject Tracks: Analog/Digital Integrated Circuits, Very Large Scale Integration (VLSI), SoC Design, Embedded Systems, AI Hardware Accelerators, Edge Computing Hardware, Quantum Computing Architectures.

Key Timelines & Submission Dates:

  • Full Paper / Abstract Submission Deadline: August 15, 2026 (Early Calls) / Final Revision Cut-off: November 15, 2026
  • Notification of Acceptance: October 25, 2026
  • Final Camera-Ready Submission Deadline: December 1, 2026

Publication & Indexing Opportunities:

All presented papers will be submitted for publication in the IEEE Xplore Digital Library and will be indexed in Scopus, Engineering Village (Ei Compendex), and Web of Science. Top-ranked papers are invited for extended journal publication in IEEE Transactions on Very Large Scale Integration (TVLSI) Systems.

Registration Fee Structure:

Category IEEE Member Fee Non-IEEE Member Fee
Indian Academic Delegate / Student INR 8,500 + 18% GST INR 11,500 + 18% GST
Indian Industry Delegate INR 15,000 + 18% GST INR 18,500 + 18% GST
International Author / Delegate USD 450 USD 550

3.2 15th IEEE International Conference on Computing, Communication and Networking Technologies (ICCCNT 2027)

Organizing Body / Technical Co-Sponsor: IEEE Section Technical Co-Sponsored

Conference Dates: January 18 – January 20, 2027

Location: IIT Indore / Virtual Hybrid Support

Major Subject Tracks: High-Performance Computing, Artificial Intelligence & Machine Learning, Cloud & Fog Computing, Cybersecurity, Information Theory, 5G/6G Wireless Networks, Internet of Things (IoT).

Key Timelines & Submission Dates:

  • Abstract & Full Paper Submission Deadline: November 10, 2026
  • Notification of Acceptance: December 12, 2026
  • Camera-Ready Paper & Registration Deadline: December 28, 2026

Publication & Indexing Opportunities:

Accepted and presented papers will be submitted to IEEE Xplore for indexing in Scopus, Google Scholar, and DBLP. Selected papers with substantial extension may be submitted to Scopus Q2/Q3 indexed special journal issues.

Registration Fee Structure:

Category Indian Authors (INR) Foreign Authors (USD)
Student / Research Scholar INR 9,000 USD 350
Faculty / Academician INR 11,000 USD 400
Industry Professional INR 14,000 USD 500

3.3 International Conference on Smart Energy Systems & Sustainable Technologies (ICSESST 2027)

Organizing Body / Publisher: Springer / Scopus Indexed Proceedings Series (LNEE)

Conference Dates: January 24 – January 25, 2027

Location: Dubai, United Arab Emirates (Hybrid Session Available)

Major Subject Tracks: Renewable Energy Systems, Smart Grid Infrastructure, Electric Vehicles (EV), Sustainable Materials, Environmental Engineering, Energy Economics, Power Electronics.

Key Timelines & Submission Dates:

  • Abstract Submission Deadline: November 25, 2026
  • Full Paper Submission Deadline: December 5, 2026
  • Acceptance Notification: December 20, 2026
  • Registration Deadline: January 5, 2027

Publication & Indexing Opportunities:

Proceedings will be published in Springer's Lecture Notes in Electrical Engineering (LNEE), indexed directly in Scopus, EI Compendex, and INSPEC.

Registration Fee Structure:

  • Academic Author / Presenter: USD 380
  • Student Presenter: USD 300
  • Listener / Co-author Attendance: USD 180
  • Indian Representative Author Rate: INR 12,500 (plus applicable taxes)

4. Prominent Scopus & IEEE Conferences in February 2027

February is widely regarded as an ideal window for presenting mid-year academic findings prior to spring thesis defense cycles. Key international conferences scheduled for February 2027 include:

4.1 18th IEEE Latin American Symposium on Circuits and Systems (LASCAS 2027)

Organizing Body: IEEE Circuits and Systems Society (CASS)

Conference Dates: February 23 – February 26, 2027

Location: Panama City, Panama

Major Subject Tracks: Nanoelectronics, Biomedical Circuits & Systems, Signal Processing, Neural Networks, Sensor Interfaces, Power Management ICs, RF & Wireless Circuits.

Key Timelines & Submission Dates:

  • Abstract & Full Paper Deadline: October 30, 2026 / Extended Target: November 30, 2026
  • Author Notification: December 18, 2026
  • Final Camera-Ready Due: January 15, 2027

Publication Opportunities:

Submitted to IEEE Xplore with indexing in Scopus and Web of Science. Extended versions of selected papers will be eligible for fast-track review in IEEE Transactions on Circuits and Systems (TCAS-I/TCAS-II).

Registration Fee Structure:

Registration Tier IEEE CASS Member IEEE Member Non-Member
Regular Author USD 480 USD 550 USD 680
Student Author USD 280 USD 320 USD 400

4.2 IEEE International Conference on Research in Computational Intelligence and Communication Networks (ICRCICN 2027)

Organizing Body: IEEE Kolkata Section / KGEC

Conference Dates: February 27 – February 28, 2027

Location: Kalyani / Kolkata, West Bengal, India (Hybrid Presentation Supported)

Major Subject Tracks: Computational Intelligence, Deep Learning, Deep Analytics, Soft Computing, Cyber-Physical Systems, Cryptography, Blockchain Technology, Smart Agricultural Systems.

Key Timelines & Submission Dates:

  • Abstract Submission Last Date: November 30, 2026
  • Full Draft Submission Deadline: December 15, 2026
  • Acceptance Intimation: January 15, 2027
  • Early Bird Registration Deadline: January 30, 2027

Publication & Indexing:

Publication in IEEE Xplore proceedings with full indexed indexing in Scopus and Google Scholar.

Registration Fee Structure:

  • IEEE Student Members (India): INR 7,500
  • Non-IEEE Student Members (India): INR 9,500
  • Faculty / Academicians (India): INR 11,500
  • Foreign Scholars: USD 300 (IEEE Member) / USD 380 (Non-Member)

4.3 21st INDIACom 2027: 14th International Conference on Computing for Sustainable Global Development

Organizing Body / Co-Sponsor: BVICAM, New Delhi / IEEE Delhi Section / IET / IETE

Conference Dates: February 24 – February 26, 2027

Location: New Delhi, India

Major Subject Tracks: Sustainable Computing, Software Engineering, Knowledge Management, E-Governance, Big Data Analytics, Human-Computer Interaction (HCI).

Key Timelines & Submission Dates:

  • Full Paper Submission Last Date: November 10, 2026
  • Notification of Acceptance: January 10, 2027
  • Submission of Camera-Ready Paper: February 8, 2027
  • Registration Deadline (Early Bird): February 22, 2027

Publication & Indexing:

Indexed consistently in Scopus and submitted to IEEE Xplore. Extended manuscripts are recommended to Scopus Q1/Q2 open-access research journal partners.

Registration Fee Structure:

Category Early Bird Fee (INR) Late / On-Spot Fee (INR)
Student / Research Scholar INR 6,000 INR 7,500
Faculty Member INR 8,000 INR 9,500
Industry Participant INR 12,000 INR 14,000
International Author USD 250 USD 300

5. Subject-Wise Breakdown of January & February 2027 Conferences

Scopus indexing extends beyond engineering and technology. The table below outlines additional upcoming Scopus-indexed conference opportunities across diverse academic fields in early 2027:

Domain / Subject Representative Conference Title Target Submission Deadline Target Scopus Publication Venue Avg. Registration Fee
Computer Science & AI International Conference on Artificial Intelligence & Data Science (ICAIDS 2027) Dec 10, 2026 Springer Communications in Computer and Information Science (CCIS) / Scopus USD 300 / INR 9,500
Electrical & Power Engineering IEEE International Conference on Power Electronics and Smart Grids (ICPESG 2027) Nov 30, 2026 IEEE Xplore Proceedings / Scopus INR 8,500 - 11,000
Management & Business Analytics International Conference on Innovation, Sustainable Business & Analytics (ICISBA 2027) Dec 1, 2026 Routledge / Taylor & Francis Edited Volumes (Scopus Indexed) USD 250 / INR 8,000
Mechanical, Civil & Robotics International Conference on Robotics, Materials & Manufacturing Technologies (ICRMMT 2027) Dec 15, 2026 AIP Conference Proceedings / IOP Materials Science / Scopus INR 7,500 - 10,000
Medical, Health & Bio-Engineering International Conference on Health Informatics & Medical Engineering (ICHIME 2027) Jan 5, 2027 Elsevier Procedia Computer Science / Scopus USD 350 / INR 12,000
Social Sciences, Education & Humanities International Conference on Multidisciplinary Educational & Social Science Research (ICMESR 2027) Dec 20, 2026 Scopus Indexed Special Journal Issue / Atlantis Press (Springer) USD 220 / INR 7,000

6. Essential Checklist for Successful Conference Submission

Submitting a research paper to a Scopus or IEEE-indexed conference requires meticulous preparation. Follow this systematic checklist to maximize your acceptance probability:

  1. Strict Adherence to Formatting Templates: IEEE conferences strictly require the IEEE 2-column conference format (available in LaTeX and MS Word). Springer or Elsevier conferences utilize specific 1-column LNCS or Procedia formats. Submissions exceeding page limits (typically 6 pages for standard submissions) without paying extra page charges are often rejected desk-side.
  2. Rigorous Plagiarism & AI Detection Audits: IEEE and Scopus publication partners utilize advanced similarity checking software (such as Turnitin, iThenticate, and CrossCheck). Overall similarity must remain strictly below 10% to 15% (excluding references), with single-source similarity under 3%. Furthermore, heavy uncredited AI text generation triggers automated rejection.
  3. Clear Empirical and Methodology Section: Technical reviewers evaluate papers based on original mathematical models, algorithm validation, empirical datasets, and comparative results against baseline literature. Ensure your methodology, flowcharts, and performance metrics (e.g., accuracy, throughput, delay, latency, precision, recall) are clearly tabulated.
  4. High-Resolution Vector Diagrams: All block diagrams, schematic drawings, and evaluation graphs must be embedded with high DPI (minimum 300 DPI) to ensure readability in final digital publishing.
  5. Verification of Conference Credibility: Verify the conference's past editions in the Scopus database or IEEE Xplore. Check if the organizers provide clear contact details, realistic peer-review timelines (minimum 3 to 6 weeks), and a recognized technical program committee (TPC).

7. How Thesislikho.com Empowers Scholars to Succeed in Scopus & IEEE Conferences

Preparing a high-quality paper for an upcoming January or February 2027 IEEE or Scopus conference can be a demanding task for researchers, doctoral candidates, and busy faculty members facing tight submission deadlines. From conceptualizing novel research architecture to formatting complex equations and resolving peer-review revisions, scholars often need professional technical support.

Thesislikho.com is a premier academic research consulting and paper development platform dedicated to guiding scholars toward publishing success in reputed national and international venues. Here is how Thesislikho.com serves as your trusted research partner:

A. Novel Topic Selection & Manuscript Drafting Support

Thesislikho.com helps researchers formulate novel problem statements and design rigorous research methodologies aligned with the technical tracks of targeted January/February 2027 IEEE and Scopus conferences. Whether in AI, VLSI, IoT, Cyber Security, Thermal Engineering, Management, or Social Sciences, expert subject specialists assist in structuring your draft into standard 6-page IEEE or publisher-specific formats.

B. Plagiarism Removal & Advanced Quality Auditing

Plagiarism or excessive similarity is a primary reason for desk rejection at IEEE and Scopus conferences. Thesislikho.com utilizes premium academic audit toolchains—including Turnitin and Drillbit—to conduct comprehensive similarity checks. Expert academic editors manually rewrite and refine content to ensure similarity indices remain well under 10% while preserving original technical depth.

C. Professional Proofreading, LaTeX Formatting, & Diagram Enhancement

Improper formatting and low-quality graphics lead to negative peer reviews. The technical editing team at Thesislikho.com provides:

  • Complete LaTeX source code drafting and template conversion (IEEEtran, Springer LNCS, ACM style files).
  • Professional typesetting for complex mathematical equations, algorithms, and pseudo-codes.
  • High-resolution diagram redesign and graph formatting to meet IEEE camera-ready specifications.
  • Academic English grammar refinement, ensuring publication-grade vocabulary and clarity.

D. Post-Review Revisions & Camera-Ready Preparation

Receiving a "Minor Revision" or "Major Revision" decision from an IEEE reviewer can be daunting. Thesislikho.com assists scholars in drafting comprehensive point-by-point author response letters, addressing reviewer comments, updating experimental data, and finalizing pristine camera-ready PDFs.

E. Extended Journal Publication Pathways

If your goal extends beyond conference proceedings to publishing expanded research in Scopus Q1/Q2, Web of Science (WoS), or SCI-indexed journals, Thesislikho.com offers end-to-end guidance—from literature review construction and quantitative statistical analysis (using SPSS, Python, MATLAB, or R) to journal selection and review submission.

Ready to Submit Your Paper for January/February 2027 Conferences?
Don't let tight abstract submission deadlines or formatting hurdles hold back your scientific contributions. Partner with Thesislikho.com to refine your manuscript, verify plagiarism compliance, and accelerate your path to Scopus and IEEE indexing.

Visit: www.thesislikho.com | Email: support@thesislikho.com | Services: Paper Writing, Thesis Assistance, Plagiarism Removal, Statistical Analysis & IEEE/Scopus Formatting.


About the Author

Dr Pankaj Mishra

Founder Director & President of Operations, Stuvalley Technology Dr. Pankaj Mishra is an edtech entrepreneur, educator, and academic leader working to make quality, future-ready learning accessible to students and researchers. As Founder Director and President of Operations at Stuvalley Technology, the company behind ThesisLikho, he connects traditional scholarship with technological innovation.

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